Optical Fiber Communication System PCB->PCB

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Shin Puu Technology Co., Ltd.

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Optical Fiber Communication System PCB

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Electronic and electrical->Electronic Parts->PCB

Product Specification

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Product Detail

Technologies

A Any layer HDI
B Aspect ratio up to 25
C Back drill
D Board thickness 10 mm
E Cavity down
F High speed and low loss materials
G Layer count up to 40
H Micro via copper fill plate
I Minimum line width and spacing 2 mil
J Thermal management-coin inserted
K Via in pad:
conductive-conductive copper paste;
non-conductive-epoxy via hole fill

Applications

Optical Fiber Conversion Module
Ethernet Module
Small form Factor Pluggable System
Thunderbolt

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